Patent Assignment
Reel/Frame 015775/0193
Assignment of Assignor's Interest
Recorded: 2004-09-09
Pages: 3
Assignors
MORI, TOSHIAKI
Executed: 2004-05-25
NAKAMURA, KAZUNORI
Executed: 2004-05-25
KURAMOCHI, SATORU
Executed: 2004-05-23
AKAZAWA, MIYUKI
Executed: 2004-05-23
NAKAYAMA, KOICHI
Executed: 2004-05-25
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA KAGACHO 1-CHOME, SHINJUKU-KU, TOKYO 162-8001, JAPAN
Covered Property
(1)
Multilayer Wiring Board and Manufacture Method Thereof