Patent Assignment
Reel/Frame 015811/0826
Assignment of Assignor's Interest
Recorded: 2004-09-20
Pages: 3
Assignors
HWANG, HYEON
Executed: 2004-06-24
KIM, DONG-KUK
Executed: 2004-07-05
JEONG, KI-KWON
Executed: 2004-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level Chip Stack Method