IP Library › Assignment 015835/0509
Patent Assignment
Reel/Frame 015835/0509

Assignment of Assignor's Interest

Recorded: 2004-09-28 Pages: 5
Assignors
FREEMAN, WILLIAM
Executed: 2004-05-12
JIANG, HONG JIN
Executed: 2004-05-12
Assignee
FINISAR CORPORATION
1308 MOFFETT PARK DRIVE, SUNNYVALE, CALIFORNIA, 94089
Covered Property (1)
Low Temperature Bonding of Multilayer Substrates
Patent: 7,259,466 →
Application: 10/740,241 →
Publication: US 2005/0011669
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Grant of Security Interest in Patents Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Assignment of Assignor's Interest Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
Patent Release and Reassignment Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →