IP Library Assignment 015839/0402
Patent Assignment
Reel/Frame 015839/0402

Assignment of Assignor's Interest

Recorded: 2004-09-27 Pages: 2
Assignor
KOH, CHOON KUAY
Executed: 2004-08-30
Assignee
HITACHI GLOBAL STORAGE TECHNOLOGIES
LOCATELLIKADE 1, PARNASSUSTOREN, 1076 AZ AMSTERDAM, NETHERLANDS
Covered Property (1)
Apparatus and Method for Aligning Solder Pads During Head Gimbal Assembly Soldering
Patent: 7,344,060 →
Application: 10/951,496 →
Publication: US 2006/0065700
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Nov 18, 2009
From: SILICON VALLEY BANK
To: ARCTURUS BIOSCIENCE, INC.
Reel/Frame 023538/0140 →
Change of Name Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
Assignment of Assignor's Interest Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →