IP Library › Assignment 015882/0017
Patent Assignment
Reel/Frame 015882/0017

Assignment of Assignor's Interest

Recorded: 2004-10-07 Pages: 3
Assignors
CHEN, CHIEN-HUA
Executed: 2004-09-13
CHEN, ZHIZHANG
Executed: 2004-09-27
MEYER, NEAL W.
Executed: 2004-09-14
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
3D Interconnect with Protruding Contacts
Patent: 7,262,495 →
Application: 10/960,827 →
Publication: US 2006/0076664
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
Patent Assignment, Security Interest, and Lien Agreement Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
Assignment of Assignor's Interest Feb 24, 2021
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 055403/0001 →