Patent Assignment
Reel/Frame 015921/0346
Assignment of Assignor's Interest
Recorded: 2004-10-20
Pages: 4
Assignors
WON, SEOK-JUN
Executed: 2004-10-08
JEONG, YONG-KUK
Executed: 2004-10-08
KWON, DAE-JIN
Executed: 2004-10-08
SONG, MIN-WOO
Executed: 2004-10-08
KIM, WEON-HONG
Executed: 2004-10-08
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Logic Device Having Vertically Extending Metal-Insulator-Metal Capacitor Between Interconnect Layers and Method of Fabricating the Same