Patent Assignment
Reel/Frame 015935/0967
Assignment of Assignor's Interest
Recorded: 2004-10-28
Pages: 3
Assignor
SAKANO, KENSHO
Executed: 2004-10-25
Assignee
NICHIA CORPORTION
491-100, OKA, KAMINAKA-CHO, ANAN-SHI, TOKUSHIMA 774-8601, JAPAN
Covered Property
(1)
Support Body for Semiconductor Element, Method for Manufacturing the Same and Semiconductor Device