Patent Assignment
Reel/Frame 015948/0399
Assignment of Assignor's Interest
Recorded: 2005-03-22
Pages: 3
Assignors
WILLIAMS, RICHARD K.
Executed: 2002-01-15
LAM, ALLEN K.
Executed: 2002-01-26
CHOI, ALEXANDER K.
Executed: 2001-05-30
Assignee
ADVANCED ANALOGIC TECHNOLOGIES, INC.
1250 OAKMEAD PARKWAY, SUITE 310, SUNNYVALE, CALIFORNIA, 94086-4519
Covered Property
(1)
Surface Mount Semiconductor Package, Die-Leadframe Combination and Leadframe Therefor and Method of Mounting Leadframes to Surface of Semiconductor Die
Patent:
6,307,755 →
Application:
09/322,127 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.