IP Library › Assignment 015974/0075
Patent Assignment
Reel/Frame 015974/0075

Assignment of Assignor's Interest

Recorded: 2005-05-05 Pages: 3
Assignors
FASANO, BENJAMIN V.
Executed: 2005-04-21
SUNDLOF, BRIAN R.
Executed: 2005-04-26
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method and Apparatus for Forming Stacked Die and Substrate Structures for Increased Packing Density
Patent: 7,250,675 →
Application: 10/908,277 →
Publication: US 2006/0249827
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: AWEMANE LTD.
Reel/Frame 057991/0960 →
Assignment of Assignor's Interest Aug 4, 2023
From: AWEMANE LTD.
To: BEIJING PIANRUOJINGHONG TECHNOLOGY CO., LTD.
Reel/Frame 064501/0498 →
Assignment of Assignor's Interest Jan 3, 2024
From: BEIJING PIANRUOJINGHONG TECHNOLOGY CO., LTD.
To: BEIJING ZITIAO NETWORK TECHNOLOGY CO., LTD.
Reel/Frame 066565/0952 →