Patent Assignment
Reel/Frame 015983/0438
Assignment of Assignor's Interest
Recorded: 2004-11-09
Pages: 2
Assignors
DANNO, TADATOSHI
Executed: 2004-09-15
TAYA, HIROYOSHI
Executed: 2004-09-21
SHIMIZU, YOSHIHARU
Executed: 2004-09-27
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Including Using a Sealing Resin to Form a Sealing Body
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →