IP Library › Assignment 016067/0624
Patent Assignment
Reel/Frame 016067/0624

Assignment of Assignor's Interest

Recorded: 2004-12-02 Pages: 3
Assignor
HARADA, TAKESHI
Executed: 2004-11-24
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property (1)
Semiconductor Device Having via Connecting Between Interconnects
Patent: 7,439,623 →
Application: 11/000,904 →
Publication: US 2005/0121792
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 23, 2009
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 022434/0348 →
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →
Change of Name Jun 12, 2024
From: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
To: NUVOTON TECHNOLOGY CORPORATION JAPAN
Reel/Frame 067711/0965 →
Assignment of Assignor's Interest Jul 30, 2024
From: NUVOTON TECHNOLOGY CORPORATION JAPAN
To: ADVANCED INTEGRATED CIRCUIT PROCESS LLC
Reel/Frame 068118/0314 →