Patent Assignment
Reel/Frame 016108/0496
Assignment of Assignor's Interest
Recorded: 2005-04-19
Pages: 3
Assignor
FLOYD, PHILIP D.
Executed: 2004-10-19
Assignee
IDC, LLC
2415 THIRD STREET, SAN FRANCISCO, CALIFORNIA, 94107
Covered Property
(1)
Method and apparatus for post-packaging release etching of interferometric modulators
Application:
60/613,320 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 19, 2005
From: FLOYD, PHILIP D.
To: IDC, LLC
Reel/Frame 016108/0513 →
Assignment of Assignor's Interest
May 5, 2005
From: IRIDIGM DISPLAY CORPORATION
To: IDC, LLC
Reel/Frame 016197/0321 →
Assignment of Assignor's Interest
Aug 11, 2016
From: IDC, LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 039654/0884 →
Assignment of Assignor's Interest
Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →