Patent Assignment
Reel/Frame 016136/0038
Assignment of Assignor's Interest
Recorded: 2004-12-22
Received: 2005-01-12
Pages: 2
Assignor
CHUANG, MENG-JU
Executed: 2004-12-01
Assignee
TOPPOLY OPTOELECTRONICS CORP.
NO. 12, KE JUNG ROAD, SCIENCE-BASED INDUSTRIAL, CHU-NAN 350, MIAO-LI COUNTY, TWX, R.O.C., TAIWAN
Covered Property
(1)
Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof
Application:
11/021,836 →