IP Library Assignment 016171/0024
Patent Assignment
Reel/Frame 016171/0024

Assignment of Assignor's Interest

Recorded: 2005-04-26 Pages: 3
Assignors
CHOI, KYOUNG-SEI
Executed: 2005-02-21
KANG, SA-YOON
Executed: 2005-02-22
KWON, YONG-HWAN
Executed: 2005-02-22
LEE, CHUNG-SUN
Executed: 2005-02-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, (SOUTH), KOREA, REPUBLIC OF
Covered Property (1)
Method for Manufacturing Tape Wiring Board
Patent: 7,299,547 →
Application: 11/086,614 →
Publication: US 2006/0003568
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Dec 6, 2024
From: FIRST-CITIZENS BANK & TRUST COMPANY, AS SUCCESSOR TO SILICON VALLEY BANK
To: AUTOMATION ANYWHERE, INC.
Reel/Frame 069532/0421 →