Patent Assignment
Reel/Frame 016199/0969
Assignment of Assignor's Interest
Recorded: 2005-01-18
Pages: 2
Assignee
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B. V.
LOCATELLIKADE 1, PARNASSUSTOREN, 1076 AZ AMSTERDAM, NETHERLANDS
Covered Property
(1)
Method and Apparatus for Reducing Heat Absorption Around Solder Pads on an Electrical Lead Suspension
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
Assignment of Assignor's Interest
Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
Security Interest
Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
Release of Security Interest at Reel 052915 Frame 0566
Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →