Assignment of Assignor's Interest

Recorded: 2005-01-21 Pages: 3

Assignor

HOOI, KEAN SEONG

Executed: 2005-01-20

Assignee

MOTOROLA, INC.

1303 E. ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196

Covered Property (1)

Method and apparatus for reducing stresses applied to bonded interconnects between substrates

Application: 11/039,975 →

Publication: US 2006/0163707

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.