Patent Assignment
Reel/Frame 016232/0803
Assignment of Assignor's Interest
Recorded: 2004-04-23
Pages: 3
Assignor
TAKEKOSHI, KIYOSHI
Executed: 2004-04-08
Assignee
TOKYO ELECTRON LIMITED
3-6, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Property
(1)
Dicing Method, Method of Inspecting Integrated Circuit Element, Substrate Holding Device, and Pressure Sensitive Adhesive Film