IP Library Assignment 016261/0117
Patent Assignment
Reel/Frame 016261/0117

Assignment of Assignor's Interest

Recorded: 2005-02-02 Pages: 2
Assignors
TAN, LIANG
Executed: 2005-02-01
ERHARDT, HERBERT J.
Executed: 2005-02-01
Assignee
EASTMAN KODAK COMPANY
ROCHESTER, NEW YORK, 14650-2201
Covered Property (1)
Metal Interconnects for Integrated Circuit Die Comprising Non-Oxidizing Portions Extending Outside Seal Ring
Patent: 8,072,066 →
Application: 11/048,975 →
Publication: US 2005/0269706
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 5, 2011
From: EASTMAN KODAK COMPANY
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 026227/0213 →