Patent Assignment
Reel/Frame 016288/0636
Assignment of Assignor's Interest
Recorded: 2005-02-14
Pages: 3
Assignors
FUJINAGA, TAKERU
Executed: 2005-02-01
HIROSE, KAZUHIRO
Executed: 2005-02-01
TAKEMORI, HIDEAKI
Executed: 2005-02-01
KOIZUMI, TOSHIAKI
Executed: 2005-02-01
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Chip Mounting Substrate, a Method of Producing the Same, and a Method of Mounting a Semiconductor Chip