IP Library Assignment 016355/0330
Patent Assignment
Reel/Frame 016355/0330

Assignment of Assignor's Interest

Recorded: 2005-08-04 Pages: 2
Assignors
BRANDENBURG, SCOTT D.
Executed: 2005-06-30
MYERS, BRUCE A.
Executed: 2005-06-30
Assignee
DELPHI TECHNOLOGIES, INC.
P. O. BOX 9005, ONE CORPORATE CENTER CT10C, KOKOMO, INDIANA, 464904-9005
Covered Property (1)
Circuit Assembly with Surface-Mount Ic Package and Heat Sink
Patent: 7,561,436 →
Application: 11/160,015 →
Publication: US 2006/0274512
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045127/0546 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →