Patent Assignment
Reel/Frame 016358/0910
Assignment of Assignor's Interest
Recorded: 2005-03-14
Pages: 6
Assignors
FUJIMOTO, TOSHIKAZU
Executed: 2005-01-23
ARAI, TOSHIAKI
Executed: 2005-01-20
TANAKA, MASAYA
Executed: 2005-01-19
Assignee
CHI MEI OPTOELECTRONICS INC.
NO. 1, CHI-YEN ROAD, TAINAN COUNTY, TAINAN SCIENCE-BASED INDUSTRIAL PARK, 744, R.O.C., TAIWAN
Covered Property
(1)
Array Substrate with a First Upper Surface of a First Insulating Film Forming a Step with a Second Upper Surface of a Plurality of Wires and a Single-Layered Second Insulating Film Positioned on the First and Second Upper Surfaces
Application:
11/036,892 →
Publication:
US 2005/0167670
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.