Patent Assignment
Reel/Frame 016411/0127
Assignment of Assignor's Interest
Recorded: 2005-03-31
Pages: 3
Assignor
CHOI, YONG-JUN
Executed: 2005-03-18
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU,, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming via Hole and Trench for Dual Damascene Interconnection
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 12, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018094/0024 →
Merger
Apr 22, 2015
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 035469/0801 →
Assignment of Assignor's Interest
Apr 24, 2015
From: DONGBU HITEK CO., LTD.
To: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
Reel/Frame 035491/0744 →
Assignment of Assignor's Interest
May 12, 2015
From: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035620/0771 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →