IP Library Assignment 016417/0328
Patent Assignment
Reel/Frame 016417/0328

Assignment of Assignor's Interest

Recorded: 2005-03-25 Pages: 3
Assignors
SAITOU, KENJI
Executed: 2005-03-23
HIDAKA, KENICHI
Executed: 2005-03-23
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
A Method of Manufacturing a Semiconductor Device with a Shallow Trench Isolation Structure
Patent: 7,449,393 →
Application: 11/090,839 →
Publication: US 2005/0221580
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0859 →