IP Library › Assignment 016423/0503
Patent Assignment
Reel/Frame 016423/0503

Assignment of Assignor's Interest

Recorded: 2005-03-16 Pages: 2
Assignor
FLOYD, PHILIP D.
Executed: 2005-03-15
Assignee
IDC, LLC
2415 THIRD STREET, SAN FRANCISCO, CALIFORNIA, 94107
Covered Property (1)
Method and System for Sealing a Substrate
Patent: 7,259,449 →
Application: 11/089,769 →
Publication: US 2006/0079098
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2005
From: FLOYD, PHILIP D.
To: IDC, LLC
Reel/Frame 016629/0092 →
Assignment of Assignor's Interest Oct 30, 2009
From: IDC,LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 023449/0614 →
Assignment of Assignor's Interest Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →