Patent Assignment
Reel/Frame 016467/0761
Assignment of Assignor's Interest
Recorded: 2005-04-15
Pages: 2
Assignors
WASHINO, RYU
Executed: 2005-01-05
SAKUMA, YASUSHI
Executed: 2005-01-05
MUKAIKUBO, MASARU
Executed: 2005-01-05
HARPREET, SINGH, HURA
Executed: 2005-01-05
UCHIDA, KENJI
Executed: 2005-01-05
Assignee
OPNEXT JAPAN, INC.
216 TOTSUKA-CHO, TOTSUKA-KU, YOKOHAMA-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Polishing Method for Semiconductor Substrate, and Polishing Jig Used Therein
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
Change of Name
Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
Assignment of Assignor's Interest
Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →