IP Library Assignment 016533/0887
Patent Assignment
Reel/Frame 016533/0887

Assignment of Assignor's Interest

Recorded: 2005-05-03 Pages: 2
Assignor
KAZEMI, HOOMAN
Executed: 2005-05-02
Assignee
ROCKWELL SCIENTIFIC LICENSING, LLC
P.O. BOX 1085, MAIL CODE A5, THOUSAND OAKS, CALIFORNIA, 91358-0085
Covered Property (1)
Semiconductor structures having via structures between planar frontside and backside surfaces and methods of fabricating the same
Application: 11/121,504 →
Publication: US 2006/0252262
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 5, 2006
From: ROCKWELL SCIENTIFIC LICENSING, LLC
To: TELEDYNE LICENSING, LLC
Reel/Frame 018583/0159 →