Assignment of Assignor's Interest

Recorded: 2005-07-19 Pages: 3

Assignors

CHO, HAN SOL

Executed: 2005-06-13

PARK, YONG YOUNG

Executed: 2005-06-13

PARK, JOON YONG

Executed: 2005-06-13

SON, YOUNG MOK

Executed: 2005-06-13

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 442-742, KOREA, REPUBLIC OF

Covered Property (1)

Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same

Application: 11/117,324 →

Publication: US 2006/0108905

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.