Patent Assignment
Reel/Frame 016551/0491
Assignment of Assignor's Interest
Recorded: 2004-10-08
Pages: 2
Assignors
MIYAKI, YOSHINORI
Executed: 2004-08-31
SHIMANUKI, YOSHIHIKO
Executed: 2004-08-30
SUZUKI, HIROMICHI
Executed: 2004-08-31
ITO, FUJIO
Executed: 2004-09-03
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYADO-KU, TOKYO, JAPAN
Covered Property
(1)
Manufacturing Method of a Semiconductor Device Utilizing a Flexible Adhesive Tape
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →