Patent Assignment
Reel/Frame 016559/0350
Assignment of Assignor's Interest
Recorded: 2005-05-11
Pages: 3
Assignor
KWON, SEUNG HO
Executed: 2005-01-28
Assignee
LG ELECTRONICS INC.
20 YOIDO-DONG, YOUNGDEUNGPO-GU, SEOUL, 150-721, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Bonding a Glass Cap and Mask for Curing Sealant
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.