Patent Assignment
Reel/Frame 016605/0566
Assignment of Assignor's Interest
Recorded: 2005-08-02
Pages: 3
Assignor
LEE, SEONG-SOO
Executed: 2005-05-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI GYEONGGI-DO (SOUTH), KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Metal Wiring Structure