Patent Assignment
Reel/Frame 016629/0012
Assignment of Assignor's Interest
Recorded: 2005-05-31
Pages: 2
Assignor
SHOJI, HIROYUKI
Executed: 2005-05-17
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Interposer substrate, semiconductor package and semiconductor device, and their producing methods
Application:
11/139,584 →
Publication:
US 2005/0263873
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.