Patent Assignment
Reel/Frame 016676/0901
Assignment of Assignor's Interest
Recorded: 2005-06-08
Pages: 2
Assignor
NAKAZAWA, TAIBO
Executed: 2005-05-31
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753,SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Chip-component-mounted device and semiconductor device
Application:
11/147,158 →
Publication:
US 2005/0275090
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.