IP Library Assignment 016718/0513
Patent Assignment
Reel/Frame 016718/0513

Assignment of Assignor's Interest

Recorded: 2005-06-20 Pages: 3
Assignors
KOBAYASHI, SHINICHI
Executed: 2005-04-22
TSUDA, ATSUNARI
Executed: 2005-05-09
KIMURA, FUSASHI
Executed: 2005-05-07
MIYAGAWA, SAKIKO
Executed: 2005-04-22
Assignee
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Property (1)
Electrooptical Device, Mounting Structure, and Electronic Apparatus Having Wiring Formed on and Protruding from a Base Material to Directly Under an Input Bump on a Semiconductor Device
Patent: 7,518,691 →
Application: 11/157,051 →
Publication: US 2006/0012745
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2016
From: SEIKO EPSON CORPORATION
To: BOE TECHNOLOGY (HK) LIMITED
Reel/Frame 037515/0050 →
Assignment of Assignor's Interest Jan 14, 2016
From: BOE TECHNOLOGY (HK) LIMITED
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 037515/0082 →