Patent Assignment
Reel/Frame 016724/0446
Assignment of Assignor's Interest
Recorded: 2005-09-06
Received: 2005-09-06
Pages: 6
Assignors
EDRY, ISAAC
Executed: 2005-09-04
KAHLON, HAIM
Executed: 2005-09-04
BERCOVICI, MICHAEL
Executed: 2005-09-05
SHEMESH, AARON
Executed: 2005-09-05
Assignee
MOTOROLA, INC.
1303 E. ALGONQUIN ROAD, LAW DEPARTMENT IL01-3RD FLOOR, SCHAUMBURG, IL, 60196, UNITED STATES
Covered Properties
(3)
Method of Fabricating High Yield Wafer Level Packages Integrating Mmic and Mems Components
Application:
11/159,473 →
System and Method for Mining of Temporal Data
Application:
11/068,498 →
Subscriber unit, a cellular communication system and a method for determining a location therefor
Application:
11/014,485 →