IP Library Assignment 016724/0446
Patent Assignment
Reel/Frame 016724/0446

Assignment of Assignor's Interest

Recorded: 2005-09-06 Received: 2005-09-06 Pages: 6
Assignors
EDRY, ISAAC
Executed: 2005-09-04
KAHLON, HAIM
Executed: 2005-09-04
BERCOVICI, MICHAEL
Executed: 2005-09-05
SHEMESH, AARON
Executed: 2005-09-05
Assignee
MOTOROLA, INC.
1303 E. ALGONQUIN ROAD, LAW DEPARTMENT IL01-3RD FLOOR, SCHAUMBURG, IL, 60196, UNITED STATES
Covered Properties (3)
Method of Fabricating High Yield Wafer Level Packages Integrating Mmic and Mems Components
Application: 11/159,473 →
System and Method for Mining of Temporal Data
Application: 11/068,498 →
Subscriber unit, a cellular communication system and a method for determining a location therefor
Application: 11/014,485 →