IP Library Assignment 016736/0496
Patent Assignment
Reel/Frame 016736/0496

Assignment of Assignor's Interest

Recorded: 2005-06-27 Pages: 4
Assignors
BRANDENBURG, SCOTT D.
Executed: 2005-04-18
LAUDICK, DAVID A.
Executed: 2005-04-18
DEGENKOLB, THOMAS A.
Executed: 2005-04-18
WALSH, MATTHEW R.
Executed: 2005-04-18
TSAI, JEENHUEI S.
Executed: 2005-04-18
Assignee
DELPHI TECHNOLOGIES, INC.
P.O. BOX 5052, LEGAL STAFF-MAIL CODE: 480-410-202, TROY, MICHIGAN
Covered Property (1)
Technique for Manufacturing an Overmolded Electronic Assembly
Patent: 7,268,429 →
Application: 11/167,473 →
Publication: US 2006/0292751
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045127/0546 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →