Patent Assignment
Reel/Frame 016802/0776
Assignment of Assignor's Interest
Recorded: 2005-07-21
Pages: 3
Assignors
PARK, HEE-BUM
Executed: 2005-07-06
KIM, OCK-JIN
Executed: 2005-07-06
PARK, JIN-HO
Executed: 2005-07-06
LEE, KWANG-SOO
Executed: 2005-07-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Tape Circuit Substrate, Semiconductor Chip Package Including the Same, and Liquid Crystal Display Device Including the Semiconductor Chip Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.