Patent Assignment
Reel/Frame 016814/0322
Assignment of Assignor's Interest
Recorded: 2005-07-28
Received: 2005-08-01
Pages: 3
Assignor
EIC ENTERPRISES LIMITED
Executed: 2005-07-06
Assignee
INNOCOMM TECHNOLOGY LIMITED
P.O. BOX 957, OFFSHORE INCORPORATIONS CENTRE, ROAD TOWN, TORTOLA, VGX, VIRGIN ISLANDS, BRITISH
Covered Properties
(11)
Digital Device Configuration and Method
Application:
11/074,154 →
Digital Device Configuration and Method
Application:
11/073,969 →
Digital Device Configuration and Method
Application:
11/074,105 →
Digital Device Configuration and Method
Application:
11/074,104 →
Digital Device Configuration and Method
Application:
11/074,365 →
Digital Storage Element Mechanical Shock Isolation Arrangement in a Host Device and Method
Application:
10/777,605 →
Digital Device Configuration and Method
Application:
10/447,544 →
Digital Device Configuration and Method
Application:
10/313,550 →
Digital Storage Element in a Host Device and Method
Application:
10/103,057 →
Digital Device Configuration and Method
Application:
09/952,998 →
Mmic Power Amplifier with Wirebond Output Matching Circuit
Application:
09/765,996 →