Patent Assignment
Reel/Frame 016816/0004
Assignment of Assignor's Interest
Recorded: 2005-01-24
Received: 2005-08-04
Pages: 4
Assignors
ISHIDA, CHIE
Executed: 2005-01-06
KON, YOSHINORI
Executed: 2005-01-06
NAKAZAWA, NORIHITO
Executed: 2005-01-06
Assignees
ASAHI GLASS COMPANY, LIMITED
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO 100-8405, JPX, JAPAN
SEIMI CHEMICAL CO., LTD.
3-2-10, CHIGASAKI, CHIGASAKI-SHI, KANAGAWA 253-8585, JPX, JAPAN
Covered Property
(1)
Semiconductor polishing compound, process for its production and polishing method
Application:
11/039,848 →