Patent Assignment
Reel/Frame 016836/0735
Assignment of Assignor's Interest
Recorded: 2005-08-02
Pages: 3
Assignors
KAWASAKI, TOMOKI
Executed: 2005-06-28
YAMADA, YUICHIRO
Executed: 2005-06-28
FUKUDA, TOSHIYUKI
Executed: 2005-06-28
OGATA, SHUICHI
Executed: 2005-06-28
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZAKADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads
Application:
11/194,691 →
Publication:
US 2006/0097371
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.