Patent Assignment
Reel/Frame 016883/0416
Assignment of Assignor's Interest
Recorded: 2005-08-15
Received: 2005-08-17
Pages: 2
Assignor
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Executed: 2005-03-20
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI-SHINBASHI 1-CHOME, MINATO-KU, TOKYO, JPX, 105-8717, JAPAN
Covered Property
(1)
Apparatus and Method for Inspecting Surface of Semiconductor Wafer or the Like
Application:
09/961,513 →