Security Agreement

Recorded: 2005-12-27 Received: 2005-12-27 Pages: 9

Assignor

UNITIVE, INC.

Executed: 2005-11-23

Assignee

BANK OF AMERICA, N.A.

901 MAIN STREET, 22ND FLOOR, DALLAS, TX, 75202, UNITED STATES

Covered Properties (5)

Electroplating Methods Including Maintaining a Determined Electroplating Voltage and Related Systems

Application: 10/044,387 →

Low Temperature Methods of Bonding Components and Related Structures

Application: 10/017,350 →

Methods and Systems for Positioning Substrates Using Spring Force of Phase-Changeable Bumps Therebetween

Application: 10/016,270 →

Methods of Forming Metallurgy Structures for Wire and Solder Bonding

Application: 09/966,316 →

Controlled-Shaped Solder Reservoirs for Increasing the Volume of Solder Bumps

Application: 09/790,421 →