IP Library Assignment 016982/0968
Patent Assignment
Reel/Frame 016982/0968

Assignment of Assignor's Interest

Recorded: 2005-09-12 Pages: 3
Assignors
LIU, WEIFENG
Executed: 2005-09-10
LEWIS, JOHN J.
Executed: 2005-09-12
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
Electronic Package with Compliant Electrically-Conductive Ball Interconnect
Patent: 7,825,512 →
Application: 11/224,919 →
Publication: US 2007/0057382
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
Patent Assignment, Security Interest, and Lien Agreement Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
Assignment of Assignor's Interest May 12, 2022
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 060005/0600 →