IP Library Assignment 016999/0410
Patent Assignment
Reel/Frame 016999/0410

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2006-01-11 Received: 2006-01-11 Pages: 11
Assignors
AZIMI, KOUROS
Executed: 2005-11-08
GLADDEN, WARREN K.
Executed: 2005-11-08
MERCHANT, SAILESH M.
Executed: 2005-11-08
RYAN, VIVIAN
Executed: 2005-11-09
CHESIRE, DANIEL PATRICK
Executed: 2005-11-11
KANG, SEUNG H.
Executed: 2005-11-16
KOOK, TAEHO
Executed: 2005-11-22
ARCHER, III, VANCE D.
Executed: 2005-12-21
Assignee
AGERE SYSTEMS, INC.
1110 AMERICAN PARKWAY NE, ALLENTOWN, PA, 18109, UNITED STATES
Covered Application (1)
INTEGRATED CIRCUIT DEVICE INCORPORATING METALLURIGICAL BOND TO ENHANCE THERMAL CONDUCTION TO A HEAT SINK
App. No. 11/235,920