Patent Assignment
Reel/Frame 017000/0227
Assignment of Assignor's Interest
Recorded: 2005-09-14
Pages: 3
Assignors
PARK, HYUNG-KEUN
Executed: 2005-09-05
JANG, WOON-JIN
Executed: 2005-09-05
KIM, YOUNG-HO
Executed: 2005-09-05
MOON, TAE-SUNG
Executed: 2005-09-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Microelectronic Device Chip Including Hybrid Au Bump, Package of the Same, Lcd Apparatus Including Microelectronic Device Chip and Method of Fabricating Microelectronic Device Chip