Patent Assignment
Reel/Frame 017027/0442
Assignment of Assignor's Interest
Recorded: 2005-09-22
Pages: 3
Assignors
KIM, SANG-YOUNG
Executed: 2005-09-05
KIM, JIN-HO
Executed: 2005-09-05
PARK, HEE-JIN
Executed: 2005-09-05
SONG, YOUNG-HEE
Executed: 2005-09-05
YOON, TAE-SUNG
Executed: 2005-09-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Bga Semiconductor Chip Package and Mounting Structure Thereof