Patent Assignment
Reel/Frame 017047/0711
Assignment of Assignor's Interest
Recorded: 2005-09-30
Pages: 2
Assignors
WATANABE, KOJI
Executed: 2005-09-20
ENAMI, TOSHIO
Executed: 2005-09-20
TAKEBE, YOSHIYUKI
Executed: 2005-09-20
SUZUKI, TATSUO
Executed: 2005-09-20
Assignee
SEKISUI CHEMICAL CO., LTD.
4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8565, JAPAN
Covered Property
(1)
Curing Resin Composition, Adhesive Epoxy Resin Paste, Adhesive Epoxy Resin Sheet, Conductive Connection Paste, Conductive Connection Sheet, and Electronic Component Joined Body