IP Library Assignment 017060/0192
Patent Assignment
Reel/Frame 017060/0192

Assignment of Assignor's Interest

Recorded: 2005-09-28 Pages: 3
Assignors
NISHIMAKI, KIMIJI
Executed: 2005-09-14
HORIUCHI, NORITAKA
Executed: 2005-09-14
Assignee
KAIJO CORPORATION
1-5, SAKAECHO, 3-CHOME, HAMURA-SHI, TOKYO, JAPAN
Covered Property (1)
Inspection Method of Bonded Status of Ball in Wire Bonding
Patent: 7,899,239 →
Application: 11/237,032 →
Publication: US 2006/0079008