IP Library Assignment 017060/0224
Patent Assignment
Reel/Frame 017060/0224

Assignment of Assignor's Interest

Recorded: 2005-10-06 Pages: 3
Assignors
SYLLAIOS, ATHANASIOS J.
Executed: 2005-09-29
TREGILGAS, JOHN H.
Executed: 2005-09-29
GOOCH, ROLAND W.
Executed: 2005-09-29
Assignee
L-3 COMMUNICATIONS CORPORATION
600 THIRD AVENUE, NEW YORK, NEW YORK, 10016
Covered Property (1)
Systems and Methods for Solder Bonding
Patent: 7,528,061 →
Application: 11/141,361 →
Publication: US 2006/0128136
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 8, 2023
From: L-3 COMMUNICATIONS CORPORATION
To: L3 TECHNOLOGIES, INC.
Reel/Frame 063564/0207 →