Patent Assignment
Reel/Frame 017077/0819
Assignment of Assignor's Interest
Recorded: 2005-04-18
Pages: 2
Assignee
MITSUBISHI MATERIALS CORPORATION
5-1, OHTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for forming compact from powder and mold apparatus for powder molding
Application:
10/531,813 →
Publication:
US 2006/0022371
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.