Patent Assignment
Reel/Frame 017081/0531
Assignment of Assignor's Interest
Recorded: 2006-01-30
Pages: 2
Assignors
KUMAKAWA, TAKAHIRO
Executed: 2005-11-22
UTSUMI, MASAKI
Executed: 2005-11-22
MATSUSHIMA, YOSHIHIRO
Executed: 2005-11-22
MATSUURA, MASAMI
Executed: 2005-11-22
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI,, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device
Application:
11/288,378 →
Publication:
US 2006/0163699
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.